Celsius PowerDC_Guiyun Electronics

Celsius PowerDC

Experience the pinnacle of efficient DC analysis for IC package and PCB signoff, integrating electrothermal co-simulation to guarantee reliable power delivery and minimize field failure risks. Benefit from cost savings, quicker turnarounds, and definitive IR drop analysis for both package and board designs.

Product Details

features

Celsius Studio Platform Highlights

By enabling early thermal simulations, our platform empowers designers to preempt costly implementations, engineering delays, and field failures. Seamlessly collaborate with mechanical engineering teams to minimize late-stage design iterations and ensure optimal product performance from the outset.

Feature name	Description
Multiphysics Technology and Field Solvers	Combining robust FEA solvers for comprehensive system analysis with advanced finite-element method (FEM) meshing technology, the Celsius Studio Platform streamlines and expedites the meshing process for complex systems.
Transient and Steady State Analysis	Accurate electrothermal co-simulation is facilitated through both transient and steady-state analysis, allowing for thorough examination of heat conduction in intricate solid structures.
Massively Parallelized Execution	Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy when analyzing 3D-ICs and complex 3D structures.
Electrothermal Reliability	Seamless, simple, and easy integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations.
Temperature Data	Design engineers have ready access to operating temperature data for reliability and performance studies.
Thermal Stress and Strain	Accurate simulation of thermal-induced stress and strain in solid, allows designers to pinpoint problem areas and avoid costly product reliability issues.
Thermal-Aware DC Analysis	Efficient DC analysis for IC package and PCB signoff, including electrical/thermal co-simulation for accuracy, swiftly identifing excessive IR drop, current density areas, and thermal hotspots, minimizing the risk of field failure.
AC Analysis	Thorough AC frequency analysis for boards and IC packages, rapidly identifying optimal decap selections and placement locations, ensuring PDN specifications are met at minimal cost.
Power-Ripple Analysis	A streamlined power ground noise simulation workflow directly from Sigrity X Platform, eliminating the need for complex S-parameter model extraction. With Sigrity X Platform integration, achieve stable time-domain power integrity simulations for PCBs or IC packages efficiently.
Sigrity Topology Explorer	This versatile topology exploration function enables exploration of power topologies across multiple fabrics. By linking the power ports of chips, packages, and boards, you can simulate complete source-to-sink connectivity. Utilizing PDN models created with Sigrity X Platform or Clarity 3D Solver, excited by a voltage regulator module (VRM) model, provides a time-domain view of PDN voltage at critical points from source to sink, facilitating identification of potential power delivery issues within system specifications.
MCAD Integration	Import complex mechanical computer-aided design (MCAD) models seamlessly from PTC Creo, Solidworks, CATIA, and other major MCAD tools, allowing for analysis without simplification. Automatically position intelligent modeling objects within the system-level model, offering automatic object-based mesh generation, optimal grid size determination for simulations, and automatic collision and modeling error checks prior to solving.

Success Cases