Celsius Thermal Solver_Guiyun Electronics

Celsius Thermal Solver

OVERVIEW

Complete Electrothermal Technology for IC Packages, PCBs, and Systems
The Cadence Celsius Thermal Solver is the industry’s first complete electrothermal co-simulation solution for the full hierarchy of electronic systems from chips, packages, and boards to full physical enclosures. The software provides analysis and design insights that empower electrical design teams to detect and mitigate thermal issues early in the design process—reducing electronic system development iterations.

Electrothermal co-simulation accurately simulates interrelated electrothermal effects. Targeting both pre-layout design and post-layout verification, the Celsius Thermal Solver enables users to quickly develop their product’s thermal management system and identify hot spots and thermal stress-related issues that are among the leading field failure risks in electronic systems.

The Celsius Thermal Solver is integrated with Cadence chip, package, and PCB design platforms, including Allegro PCB Designer, AWR Design Environment, the Innovus Implementation System, the Virtuoso Design Platform, and the Voltus IC Power Integrity Solution. Designers can work in a single environment, share data, and enable automation between workflows and user interfaces.

Product Details

KEY BENEFITS

Thermal Analysis Delivering Speed, Accuracy, Capacity, and Streamlined Workflows

Design Insight

Minimizes late-stage design iterations, costly implementations, engineering delays, product iterations, and field failures by enabling designers to perform thermal simulations early in the design phase

Greater Productivity

Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy

Electrothermal Reliability

Seamless, simple, and easy integration with Cadence IC, package, microwave/RF, and PCB implementation platforms accelerates and simplifies design iterations

Complete System Analysis

Multiphysics technology combines FEA for solid structures with CFD for fluids to enable detailed analysis of the entire system

Features

Transient as well as steady-state analysis enables accurate electrical-thermal co-simulation to analyze transient, steady-state, and heat conduction in complicated solid structures
Provides ready access to operating temperature data for reliability and performance studies
Import and analyze large package and PCB designs in full detail with no input simplification and perform joule-heating, stress, and warpage analysis
Accurately simulate thermal-induced stress and strain in solid allows designers to pinpoint problem areas and avoid costly product reliability issues
Advanced finite-element method (FEM) meshing technology makes meshing any complex system fast and easy

Success Cases