Clarity 3D Solver

3D Electromagnetics Analysis of PCBs, IC Packages, and SoIC Designs

The Cadence Clarity 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. The Clarity 3D Solver helps designers tackle the most complex electromagnetic (EM) challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning applications with gold-standard accuracy.

Cadence’s industry-leading distributed multiprocessing technology in the Clarity 3D Solver delivers the virtually unlimited capacity and 10X speed required to efficiently and effectively address larger and more complex structures. It creates highly accurate S-parameter models for use in high-speed signal integrity (SI), power integrity (PI), high-frequency RF/microwave applications, and electromagnetic compliance (EMC) analysis, enabling simulation results that match lab measurement, even at 112Gbps+ data transfer speeds. The Clarity 3D Solver solves true 3D structures by efficiently matching the available computing resources to the size of the design.

Product Details


Save Design Time and Computing Resources

EM Simulations Delivering Speed, Accuracy, and Capacity

Enables engineers to tackle the most complex EM challenges in a single simulation quickly and with gold-standard accuracy

Complete Design and Analysis Flow

Seamlessly integrated with Cadence Virtuoso and Allegro SiP and PCB designer tools, providing a complete design and analysis flow

Parallelization with Unbounded Scalability

Massively parallelized matrix solver technology with adaptive mesh refinement and frequency sweep processes for near-linear scalability

Solve for 3D Structures with Cloud Infrastructure

Web-based cloud servers enable designers to select lower cost cloud-computing resources and still maintain the highest performance when solving for 3D structures

Clarity 3D Solver Features

  • Integrated 3D solutions: Easily integrate with Cadence Allegro Package Designer Plus SiP Layout Option and Virtuoso and Allegro platforms to optimize in the analysis tool and implement in the design tool without redrawing
  • S-parameter extraction: Use Clarity 3D Solver’s accurate S-parameters to characterize the field coupling between ports in SI/PI, high-frequency RF/microwave, and EMC applications for signoff-level confidence
  • Breakthrough parallelization: Allows engineering managers more flexibility when budgeting for the computer configurations required for 3D simulation
  • Enhanced usability: Automatically matches computing resources available to the structure being solved, so 3D experts and non-3D experts can get fast and accurate results
  • Model an EM interface: Merge mechanical structures such as cables and connectors with the system design and model an EM interface as a single model
  • Accessibility: Brings true 3D analysis to any engineer with either desktop, on-premises, or cloud HPC resources




Success Cases